The TG edge copper-plated multi-layer printed circuit board (PCB) produced by Mingzhenghong Electronics Co., Ltd. uses TG250 grade FR-4 material to ensure the stability and reliability of the board in high temperature environments. The board thickness of this product is 3.0mm, and it adopts edge copper plating technology to realize the connection of the conductive layer on the edge of the board.
- Using TG250 grade FR-4 material to ensure excellent stability and reliability in high temperature environments; - Using 3.0mm plate thickness and edge copper plating technology to achieve effective connection of the conductive layer on the edge of the board; - Surface treatment using hard gold 15u", optimizes weldability and conductivity, and enhances product durability; - Maintains minimum aperture 0.3mm and 5mil line width and line spacing to meet precision processing standards; - Produced strictly in accordance with IPC-II standards to ensure high quality and long-term product reliability.
- Adapted to high-speed transmission equipment that has strict requirements on stability and high temperature resistance; - Applications in the field of 5G communication technology, such as base stations and network equipment; - Semiconductor testing equipment and other high-tech industries that require fine circuit control; - For circuits Military and aerospace industries that have strict requirements on board performance and durability; - Medical equipment and automotive electronic systems that require high-reliability circuit board solutions.
