Hybrid structure PCB four-layer rigid-flex board - the perfect combination of high performance and flexibility
					
							04 10,2024
							Mingzhenghong Electronics Co., Ltd.
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							The new four-layer rigid-flex PCB launched by Mingzhenghong Electronics combines the flexibility of flexible PCB with the stability of rigid PCB, and is widely used in high-demand fields such as power supply, 5G CPE, antenna, etc. It adopts advanced OSP+ENIG surface treatment to provide excellent conductivity and corrosion resistance, 2OZ copper thickness design ensures reliable operation of products in high-power environments, and customized impedance design ensures signal integrity, providing customers with high-reliability and high-performance PCB solutions.
						
					
							Product Introduction
 The four-layer rigid-flex PCB provided by Mingzhenghong Electronics combines the characteristics of flexible and rigid PCBs and is suitable for applications requiring high flexibility. The surface treatment uses OSP (organic anti-rust film) + ENIG (electrodeposited nickel/immersion gold), which increases conductivity and corrosion resistance while ensuring weldability. The product specifically adopts a 2OZ copper thickness design, which is suitable for high-power environments, and the special stacking design can meet the needs of different impedance values. The four-layer rigid-flex PCB is widely used in power supplies, 5G CPE equipment, antennas and other fields. Through precision design and manufacturing, Mingzhenghong provides customers with high-reliability and high-performance PCB solutions.
 Advantages and features
-  Highly integrated and flexible, it combines the flexibility of a soft board with the stability of a hard board, and can adapt to various complex installation environments.
-  Precision manufacturing, the board thickness tolerance is controlled at 1.2mm±0.12mm, the flexible area reaches 0.15mm±0.03mm, supporting high-density wiring and tiny aperture 0.15mm processing.
-  Outstanding surface treatment technology, the OSP+ENIG combination not only ensures the welding quality, but also improves the corrosion resistance and conductivity of the product.
-  Enhanced power handling capability and 2OZ copper thickness design are suitable for high power environments, ensuring long-term stable operation of the product.
-  Customized impedance matching and special stacking design can meet specific impedance requirements to ensure signal integrity.
 Scope of application
-  Power module manufacturing, especially for electronic devices requiring high power transmission and temperature resistance.
-  5G CPE equipment in the communications industry meets the needs of high frequency and high-speed transmission in 5G communications and ensures signal stability.
-  Antennas and RF modules are suitable for fields with special requirements on electrical performance and spatial layout.
-  Wearable devices and smart electronic products have high requirements on PCB bending performance and reliability.
-  Medical equipment and automotive electronics require high-precision applications that combine hard impedance control with flexible wiring design.
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