Introducing the High Precision 34-Layer Laser Blind Hole PCB from Ming Zheng Hong Electronics Co., a true marvel for engineers and designers who require reliability and performance!
With an impressive capability of producing a 35 layers board, we utilize advanced back drilling and laser blind hole technology. This ensures superior electrical connectivity and integrity for high-performance applications, making it a perfect fit for semiconductor testing equipment.
Notably, our PCB is made from high-quality FR-4 TG180 ITEQ(IT180A) material with a thickness of 5.0mm and a minimum hole diameter of just 0.3mm. This allows for a highly dense layout, accommodating even the most complex circuit designs.
Instead of experiencing common distortion issues, our process guarantees a distortion rate controlled below 0.5%, making it surpass the IPC-II standard. Who knew stability could feel so good? 😄
So, whether you're building the latest in 5G technology, developing energy-efficient products, or working on high-end consumer electronics, our high-precision multi-layer PCBs will meet your needs.
Join us in embracing the future of high-performance electronic testing with our innovative PCB solutions. Get in touch today to discover how we can work together to elevate your projects!
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