High-Performance HDI PCB for Semiconductor Testing - Precision High TG IC Testing Solutions
04 03,2025
Mingzhenghong Electronics Co., Ltd.
News
Discover our precision-engineered High TG IC Testing HDI PCB designed specifically for semiconductor testing applications. Utilizing high TG180 material, advanced HDI technology, and robust design features, our PCBs ensure exceptional performance, reliability, and stability in high-demand environments. Suitable for automotive, aerospace, telecommunications, and medical electronics, our solutions excel in providing high-density interconnects and superior electrical performance.
Introduction to HDI PCB Technology
High-density interconnect (HDI) printed circuit boards (PCBs) have revolutionized the semiconductor industry, providing solutions that meet the stringent demands of performance and reliability. In this article, we explore the advanced capabilities of our High TG IC Testing HDI PCB, highlighting its key features and applications in semiconductor testing.
The Challenge: Demands of Semiconductor Testing
As technology advances, the complexity of semiconductor devices increases, resulting in higher performance expectations. Tester platforms require PCBs that can withstand thermal stresses, deliver precise electrical performance, and support high-density interconnections. Manufacturers face the challenge of meeting these demands while ensuring reliability and efficiency in production.
Our Solution: High TG IC Testing HDI PCB
Our High TG IC Testing HDI PCB is engineered with high TG180 FR-4 material, which offers exceptional thermal stability and reliability under demanding conditions. With precise dimensions of 320X410mm (12.598X16.142 inches) and a thickness of 5.0mm, our PCB is designed to meet the rigorous requirements of semiconductor testing.
Key Features:
- Minimum drill size of 0.4mm, ensuring high precision.
- Utilization of 30um outer layer copper thickness, along with 18um and 35um inner layer thickness, providing excellent electrical performance.
- Support for a minimum line width and spacing of 4mil (0.1mm), enabling high-density interconnects.
- Advanced blind via and buried via capabilities, enhancing signal integrity.
- ENIG (Electroless Nickel Immersion Gold) surface finish ensures durability and high-frequency performance.
- Visually clear design with a black solder mask and white silkscreen for easy assembly and testing.
Applications of High TG IC Testing HDI PCB
Our HDI PCB excels in various high-tech industries, including:
- Automotive Electronics: Essential for testing high-performance electronic components.
- Aerospace: Used in applications that require high reliability under extreme conditions.
- Telecommunications: Ideal for testing high-speed circuit boards, particularly in 5G technologies.
- Medical Electronics: Designed for precision and high trust in medical device circuit board testing.
- Industrial Automation: Providing high-temperature resistance and high-density interconnect solutions.
Conclusion: The Future of Semiconductor Testing
As the semiconductor industry continues to innovate, the demand for high-performance HDI PCBs like our High TG IC Testing solution will grow. By leveraging cutting-edge materials and technology, we provide manufacturers with the ability to meet these challenges with confidence, ensuring that their products remain at the forefront of the technology curve.
Explore Our HDI PCB Solutions
To learn more about our High TG IC Testing HDI PCBs and how they can enhance your semiconductor testing operations, view the image of our state-of-the-art PCB below:
Our commitment to quality and performance ensures that you get the utmost in reliability and efficiency for all your IC testing needs.